Thermal conductive paste H, your solution for heat conduction with excellent protection
In today’s world, where electronics are becoming increasingly advanced and devices operate under greater stress, effective heat dissipation becomes crucial. Here is Thermal Conductive Paste H, a product that primarily provides exceptional thermal conductivity above 0.88 W/mK, ensuring optimal cooling for your devices.
Why Thermal Conductive Paste H?
Our paste has been specifically designed to facilitate the flow of heat between electronic components and the heat sink. It is an essential part of the proper functioning of temperature sensors, protecting them from environmental influences and preventing breakdowns. Moreover, its unique formula is characterized by excellent chemical resistance to oxidation. It resists the effects of aqueous solutions of acids, alkalis, salts, as well as sulfur dioxide and ammonia. Additionally, it is highly resistant to electric current flow, increasing the safety of its use.
Wide application
Whether you are working on modules with high heat conduction coefficients, cooling devices, storage drives, motor control systems, power converters, high-power LEDs, laptops, computers, network communication devices, home appliances, electronic and electrical components, or air conditioners – Thermal Conductive Paste H is the ideal solution for a wide range of applications. Our product ensures smooth operation from -50°C to 250°C, with a density of 2.58 g/cm³.
